Product Introduction
Bisphenol A Type Solid Epoxy Resin: We supply A-450 series and A 600 series.They are low molecular solid bisphenol A type epoxy resins, with suitable crosslinking density, high adhesion, high water resistance characteristics. Compared with the common solid epoxy resin on the market, they have lower total chlorine so they have better electrical properties.They are especially suitable for chlorine-sensitive fields, such as electronics, semiconductor manufacturing, and anti-corrosion coatings in water treatment and seawater desalination systems, avoiding corrosion problems caused by chloride ions.
CAS NO. 25068-38-6
Chemical Composition
Polymer of 4,4-(1- methylethylene) biphenol &(chloromethyl) ethylene oxide
Product Properties
|
BPA epoxy |
Epoxy equivalent g/eq |
Viscosity mPa.s/25s℃ |
Easily hydrolyzed chlorine ppm |
Total chlorine ppm |
|
|
Solid |
A-450 |
450-500 |
65-75 |
<300 | <1500 |
| A-450B | <200 | <800 | |||
|
A-450H |
<150 |
<600 |
|||
| A-450S | <100 | <300 | |||
|
A-450U |
<50 |
<100 |
|||
| A-450UH | <10 | <50 | |||
|
A-600H |
600-650 |
80-90 |
<150 |
<600 |
|
|
A-600U |
<50 |
<100 |
|||
Product Application
The Bisphenol A type solid epoxy resin A-450 series and A-600 series are white, transparent solid particles with a narrow molecular weight distribution. These resins are suitable for applications in epoxy powder coatings, plastic sealing materials, laminates, electronic adhesives, and other fields.
Epoxy Powder Coatings:
These resins are used for corrosion prevention, beautification, and protection of pipes, bridges, home appliances, auto parts, and furniture.
Plastic Sealants:
They are utilized in the packaging of integrated circuits (ICs), LED lights, and sensors, providing both physical protection and electrical insulation.
Laminates:
These resins are applied in the manufacturing of printed circuit boards (PCBs), insulation materials for electrical equipment, and building decoration materials.
Electronic Adhesives:
They are used for chip bonding, heat conduction, structural component bonding, and waterproof sealing, ensuring the reliability and performance of electronic equipment.
Product Packaging & Storage
25Kg inner PE bag, 25Kg drum packing
Store in cool, dry and ventilated place, period of validiity is 1 year.
FAQ
Q: Does this resin meet RoHS and halogen-free requirements?
A: Yes, low-chlorinated bisphenol A solid epoxy resins are specially designed to meet the RoHS Directive and halogen-free requirements, and are suitable for the production of environmentally friendly electronic components and semiconductor packaging materials to ensure compliance with the end product.
Q: Customer concern: Is the coating with this resin effective in preventing corrosion caused by chloride ions?
A: Yes, the low chlorine properties of The Bisphenol A type solid epoxy resin reduce the chloride content of the coating, significantly reducing the risk of corrosion caused by chloride ion penetration, and is particularly suitable for the protection of equipment and structures in contact with seawater.
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