Product Introduction
Bisphenol F Type Liquid Low Viscosity Epoxy Resin(CAS 2095-03-6): The F-160 series is a high-purity BPF epoxy resin with lower total chlorine content. Compared to bisphenol A-type epoxy resins, the F-160 series is characterized by its extremely low viscosity, strong adhesion, and excellent chemical corrosion resistance. Its low viscosity facilitates easier handling during processing, making it particularly suitable for applications requiring good fluidity, such as dipping, spraying, or perfusion.
CAS NO. 2095-03-6
Chemical Composition
Polymer of bis-(hydroxy-phenyl)methane (bisphenol F) and epichlorohydrin
Product Properties
|
BPA epoxy |
Epoxy equivalent |
Colour |
Viscosity |
Easily hydrolyzed chlorine ppm |
Total chlorine |
Product |
|
|
Low Viscosity Liquid |
F-160B |
156-165 |
<30 |
1000-1400 |
<200 | <800 | |
|
F-160H |
<150 |
<600 |
Low total chlorine |
||||
|
F-160S |
<100 |
<300 |
|||||
|
F-160U |
<50 |
<100 |
|||||
|
F-160UH |
<10 |
<50 |
|||||
Product Application
Bisphenol F Type Liquid Low Viscosity Epoxy Resin
This resin is primarily used in coatings, fiber winding materials, packaging adhesives, CCL, and other fields.
Electronic Packaging: Its low viscosity makes it suitable for packaging precision electronic components, allowing it to fill small gaps effectively and provide excellent insulation properties.
Composites: It is widely used in the production of fiber-reinforced plastics (FRP) and other composites, especially for parts requiring complex shapes and fine structural details.
Coatings & Adhesives: It is suitable for high-performance coatings and adhesives, especially those designed for low volatile organic compound (VOC) emissions and high solid content.
Product Packaging & Storage
25Kg or 220Kg metal drum packing
Store in cool, dry and ventilated place, period of validiity is 1 year.
FAQ
Q: What is the applicable temperature range?
A: Bisphenol F type epoxy resins can be used across a broad temperature range. Uncured resins can be stored at room temperature, while cured products can withstand temperatures from -40°C to 150°C or higher, depending on the specific formulation and curing conditions.
Q: What documents will you provide about the product?
A:We will provide you with COA, TDS, and MSDS
Q: What are the advantages of this resin in electronic packaging?
A: Bisphenol F Type Liquid Low Viscosity Epoxy Resins have several advantages, including its low viscosity, which allows them to penetrate small gaps easily and form a thin, uniform protective layer. They can also provide excellent electrical insulation and chemical resistance. Additionally, their low hygroscopicity and good thermal stability help protect sensitive electronic components from environmental damage.
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