Product Introduction
Bisphenol F Type Liquid Medium Viscosity Epoxy Resin(CAS 2095-03-6): The F-170 series is a high-purity BPF epoxy resin with low total chlorine content. It has low viscosity, strong adhesion, and excellent chemical corrosion resistance, additionally,it is not easy to crystallize.
CAS NO. 2095-03-6
Chemical Composition
Polymer of bis-(hydroxy-phenyl)methane (bisphenol F)and epichlorohydrin
Product Properties
|
BPF epoxy |
Epoxy equivalent |
Color |
Viscosity |
Total chlorine ppm |
Easily hydrolyzed chlorine ppm |
Product characteristics |
|
|
Medium Liquid |
F-170H |
168-178 |
<30 |
2800-3500 |
<600 |
<100 |
Non-crystallization |
|
F-170S |
168-178 |
<30 |
2800-3500 |
<300 |
<80 | ||
|
F-170U |
168-178 |
<30 |
2800-3500 |
<100 |
<50 | ||
|
F-170UH |
168-178 |
<30 |
2800-3500 |
<50 |
<10 | ||
Product Application
Application of Bisphenol F Liquid Medium Viscosity Epoxy Resin
This resin has low viscosity and strong adhesion to substrates, which makes it suitable for using in electronic packaging, adhesive, and composite materials.
It has excellent electrical properties and is maimly used to encapsulate electronic components, such as integrated circuits and semiconductor devices. This encapsulation effectively protects components from environmental factors, thereby improving product reliability and extending service life.
Product Packaging & Storage
25Kg or 220Kg metal drum packing
Store in cool, dry and ventilated place, period of validiity is 1 year.
FAQ
Q: What is the thermal stability of this resin in electronic packaging?
A: Bisphenol F type epoxy resins have excellent thermal stability, making their properties over a wide temperature range. They are suitable for electronic packaging and can withstand high-temperature processes, such as reflow soldering, without compromising the performance of electronic components.
Q: Can you provide samples?
A: Yes, we usually provide 100-200g for free. However, the international express fee will need to be covered by you. This fee can be deducted from your subsequent order.
Q: When it is used as an adhesive, how strong is the bond to different materials?
A: When Bisphenol F Type Liquid Medium Viscosity Epoxy Resin used as adhesives ,it can provide excellent bonding strength for metals, plastics, glass, wood and other materials, especially for bonding applications requiring high strength and long-term stability.
Hot Tags: bisphenol f type liquid medium viscosity epoxy resin, China bisphenol f type liquid medium viscosity epoxy resin manufacturers, suppliers, factory, 1 2 Hexylene Glycol, Tetra Methyl Ammonium Chloride, Phthalic anhydride OX BASE, polyether polyol resin mixture, Pentaerythritol for resin, TPAC 99
