Crystalline Biphenyl Epoxy Resin

Crystalline Biphenyl Epoxy Resin
Details:
Crystalline Biphenyl Epoxy Resin( CAS 85954-11-6) :The E-4000 series is produced by the reaction of TMBP and ECH, featuring a liquid crystal unit structure along with characteristics such as low viscosity, low total chlorine, and low ion content. After curing, the resin exhibits excellent heat resistance and chemical stability. These products are suitable for applications in composite materials, CCL, PCB inks, and epoxy encapsulants.
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Description
Technical Parameters
Product Introduction
 

 

Crystalline Biphenyl Epoxy Resin( CAS 85954-11-6) :The E-4000 series is produced by the reaction of TMBP and ECH, featuring a liquid crystal unit structure along with characteristics such as low viscosity, low total chlorine, and low ion content. After curing, the resin exhibits excellent heat resistance and chemical stability. These products are suitable for applications in composite materials, CCL, PCB inks, and epoxy encapsulants.

 

CAS NO.85954-11-6

product-378-117

Chemical Composition

 

Polymer of 3,3',5,5'-tetramethyl-4,4'-dihydroxybiphenyl and (chloromethyl group) ethylene oxide

 

Product Properties
 

 

Tetramethyl biphenyl
Diphenol epoxy

Epoxy equivalent
g/eq

Melting
point

Viscosity
mPa.s/25℃

Total
chlorine
ppm

Easily
hydrolyzed chlorine
ppm

Product
characteristics

Solid

E-4000H

178-188

105-115

5-20

800

200

Low viscosity

Low total chlorine

low ion content

E-4000U

178-188

105-115

5-20

300

100

 

Product Application
 

 

product-800-448

Crystalline Biphenyl Epoxy Resin is mainly used in composite materials, CCL, PCB inks and other fields.

 

Electronic Packaging Materials: It is used in the packaging of high-reliability electronic devices, such as integrated circuits (ICS), microelectronic components, and high-power LED. This resin effectively protects components from environmental impacts while withstanding high temperatures during soldering and operation.

High-End Composite Materials: As a matrix resin, it can combined with reinforcement materials such as carbon fiber and glass fiber to produce high-performance composites. These materials are widely used in sports equipment (e.g., golf clubs, racing parts), wind turbine blades, and high-end automotive parts, helping to reduce weight while enhancing strength and durability.

 

Product Packaging & Storage
 

 

product-602-343
product-800-392

 

1.Packaging: 25Kg PE bag inside,compund kraft paper bag outside.

2.Transportation: This product is non-flammable and is stored and transported as a general chemical.

3.Storage: It should be stored in a dry and ventilated place, shelf life of 1 year.

 

FAQ
 

 

Q: What are the advantages of this resin over ordinary epoxy resin?

A: The advantages of crystalline biphenyl epoxy resins are their higher thermal deformation temperature and better chemical resistance. Due to the structure of biphenyl rings, the resin forms a more stable crystalline structure, which makes it maintain good mechanical properties and dimensional stability under high temperature environment.

 

Q: What is your general delivery time?

A: It depends on the model you need and our inventory. We generally have some stock of commonly used models, and the delivery time is generally 3-15 days.

 

Q: What are the specific applications in the electronic and electrical industry?

A: In electrical industry, crystalline biphenyl epoxy resins are often used to make advanced circuit boards, semiconductor packaging materials, high-voltage insulation materials and high-frequency electronic device packaging. Its high heat resistance and low dielectric constant make it ideal for applications where thermal stability and electrical performance are critical.

 

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