Product Introduction
Low Chloride Low Viscosity Non-crystallizing Epoxy Resin is the blend of the polymer of bis-(hydroxy-phenyl)methane (bisphenol F) and epichlorohydrin as well as the polymer of 4,4-(1-methylethylene) biphenol and epichlorohydrin. and the proportion of the two substances varies from 10%-90% according to customer requirements.
Chemical Structure
Chemical Composition
The blend of the polymer of bis-(hydroxy-phenyl)methane (bisphenol F) and epichlorohydrin as well as the polymer of 4,4-(1- methylethylene) biphenol and epichlorohydrin
Product Properties
|
A/F epoxy |
Epoxy |
Color |
Viscosity |
Total |
Easily |
Product |
|
|
Low Viscosity Liquid |
X-165H |
160-170 |
<15 |
2000-3000 |
<600 |
<150 |
Low total chlorine |
|
X-165S |
160-170 |
<15 |
2000-3000 |
<300 |
<100 |
||
|
X-165U |
160-170 |
<15 |
2000-3000 |
<100 |
<50 |
||
|
X-165UH |
160-170 |
<15 |
2000-3000 |
<50 |
<10 |
||
|
Note:The viscosity,total chlorine,and epoxy equivalent of the product can be adjusted appropriately according to customer requirements,and this technical indicator is only used as a reference basis |
|||||||
Product Application
Low Chloride Low Viscosity Non-crystallizing Epoxy Resin has low viscosity, high purity and will not crystallize during a long time, and it has strong affinity with the substrate, which can be used in liquid electronic packaging, single/two-component adhesives, conductive adhesives and other fields:
1. It can be used in the packaging of semiconductor devices, integrated circuits, LED and other electronic components, With low viscosity, the resin can cover uniformly and penetrate the fine structure, forming a protective film to prevent moisture, dust and mechanical damage, and extend the life of electronic products.
2.Epoxy resin conductive adhesive combines the high strength bonding properties of epoxy resin with the conductivity of conductive fillers (such as silver powder, copper powder, carbon nanotubes, etc.) for bonding and electrical connections of electronic components.
Product Packaging & Storage
1.Packaging: 25Kg or 220Kg metal drum.
2.Transportation: This product is non-flammable and is stored and transported as a general chemical.
3.Storage: It should be stored in a dry and ventilated place, shelf life of 1 year.
FAQ
Q: What is the resistance of this resin to heat and cold? Can it withstand extreme temperature conditions?
A: Low-chlorine low-viscosity non-crystallizing epoxy resins generally have a wide temperature range and can maintain good performance in the temperature range of -40°C to 150°C (or higher), ensuring the stability and reliability of electronic components under extreme temperature conditions.
Q: How to ensure that the bubbles in the packaging process are minimized?
A: The low viscosity of Non-crystallizing Epoxy Resin helps to reduce the formation of bubbles during the perfusion process, and it is recommended to use vacuum defoaming treatment, as well as reasonable sizing and curing processes, to further reduce the bubbles in the packaging material and ensure the integrity and beauty of the package.
Q: How do you guarantee the quality of your products?
A: Our factory has a strict quality control system with ISO 9001 certification. We will conduct quality inspection for each batch of goods and issue the corresponding quality inspection report
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